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SiA513DJ
Vishay Siliconix
N- and P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
4.5
N-Channel
P-Channel
V DS (V)
20
- 20
R DS(on) ( Ω )
0.060 at V GS = 4.5 V
0.092 at V GS = 2.5 V
0.110 at V GS = - 4.5 V
0.185 at V GS = - 2.5 V
I D (A)
a
4.5 a
- 4.5 a
- 4.5 a
Q g (Typ.)
3.5 nC
3 nC
? Halogen-free
? TrenchFET ? Power MOSFETs
? New Thermally Enhanced PowerPAK ?
SC-70 Package
- Small Footprint Area
- Low On-Resistance
RoHS
COMPLIANT
PowerPAK SC-70-6 Dual
APPLICATIONS
? Portable Devices
D 1
1
S 1
2
G 1
3
D 2
Markin g Code
D 1
S 2
D 1
6
G 2
5
2.05 mm
4
S 2
D 2
2.05 mm
Part # code
EBX
XXX
Lot Tracea b ility
and Date code
G 1
G 2
S 1
D 2
Orderin g Information: SiA513DJ-T1-GE3 (Lead (P b )-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
N -Channel MOSFET
P-Channel MOSFET
Parameter
Symbol
N-Channel
P-Channel
Unit
Drain-Source Voltage
Gate-Source Voltage
V DS
V GS
20
± 12
- 20
V
T C = 25 °C
4.5 a
- 4.5 a
Continuous Drain Current (T J = 150 °C)
Pulsed Drain Current
Source Drain Current Diode Current
T C = 70 °C
T A = 25 °C
T A = 70 °C
T C = 25 °C
T A = 25 °C
T C = 25 °C
I D
I DM
I S
4.5 a
4.5 a, b, c
3.2 b, c
15
4.5 a
1.6 b, c
6.5
- 4.5 a
- 3.3 b, c
- 2.4 b, c
- 10
- 4.5 a
- 1.6 b, c
6.5
A
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
5
1.9 b, c
5
1.9 b, c
W
T A = 70 °C
1.2 b, c
1.2 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
N-Channel
P-Channel
Parameter
Symbol
Typ.
Max.
Typ.
Max.
Unit
Maximum Junction-to-Ambient b, f t ≤ 5s
Maximum Junction-to-Case (Drain) Steady State
R thJA
R thJC
52 65 52 65
12.5 16 12.5 16
°C/W
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile ( h ttp://www.vishay.com/ppg?73257 ). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W.
Document Number: 70443
S-80437-Rev. B, 03-Mar-08
www.vishay.com
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